SEMI.DATA - signals
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development
NIST - 2024-07-09
CHIPS R&D Office announcing funding opportunity for domestic semiconductor advanced packaging R&D across equipment, processes, thermal management, connectors, chiplets, and EDA to accelerate domestic manufacturing capacity.
| Signal type | regulatory_update |
|---|
| Strategic importance | high |
|---|
Primary source: https://www.federalregister.gov/documents/2024/07/09/2024-14980/chips-national-advanced-packaging-manufacturing-program-napmp-advanced-packaging-research-and
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