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CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development

Name: CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development
Creator: SemiData
License: https://semidata.dev

NIST - 2024-02-01

U.S. Commerce Department announces $300M CHIPS R&D funding competition to develop domestic advanced packaging substrates and materials manufacturing capacity as a strategic response to semiconductor supply chain vulnerabilities.

Signal type	strategic_reserve
Strategic importance	high
Materials	advanced packaging substrates, substrate materials
Countries	United States

Primary source: https://www.federalregister.gov/documents/2024/02/01/2024-02026/chips-national-advanced-packaging-manufacturing-program-napmp-materials-and-substrates-research-and

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